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Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability,Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders |
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| Authors: | Kathlene N. Reeve Stephanie M. Choquette Iver E. Anderson Carol A. Handwerker |
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| 本文献已被 SpringerLink 等数据库收录！ | |