功率模块压接型IGBT温度循环试验热负载施加方法

温度循环试验是研究功率模块压接型绝缘栅双极型晶体管（insulated gate bipolar transistor,IGBT）特性的重要试验手段。为此，以柔直换流阀功率模块压接型IGBT为研究对象，结合理论计算与有限元仿真分析，提出了温度循环试验热负载施加方法，并获得相应的电输入目标参数。搭建了温度循环试验平台，对器件温度进行实时监测，综合对比分析功率模块受试IGBT器件的结温、壳温、散热器测温点温度数据。通过仿真结果验证了所提方法的有效性，可为同类型压接IGBT试验提供研究思路。

Thermal Load Application Method for Temperature Cycle Test of Power Module PP-IGBT

Temperature cycling test is an important test method to study the thermal fatigue aging characteristics of power module press pack insulated gate bipolar transistor (PP-IGBT) devices. Therefore, taking the PP-IGBT of flexible direct converter valve power module as the research object, and combined with theoretical calculation and finite element simulation analysis, a thermal load application method for temperature cycle test is proposed, and the corresponding electrical input target parameters are obtained. A temperature cycle test platform is built to monitor the device temperature in real time, and a comprehensive comparison analysis is made on the temperature data of the junction, shell and heatsink at the measuring point of the tested power module IGBT devices. The simulation results have verified the effectiveness of the proposed method, and can provide a research approach for the PP-IGBT test of the same type.