| A review of soldering by localized heating |
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| 作者姓名： | 崔鹏 杨婉春 彭飞 祝温博 杨帆 李明雨 |
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| 作者单位： | 1. Sauvage Laboratory for Smart Materials,School of Materials Science and Engineering,Harbin Institute of Technology (Shenzhen);2. State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology |
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| 摘 要： | In recent years, the rapid development of the new energy industry has driven continuous upgrading of high-density and highpower devices. In the packaging and assembly process, the problem of differentiation of the thermal needs of different modules has become increasingly prominent, especially for small-size solder joints with high heat dissipation in high-power devices. Localized soldering is considered a suitable choice to selectively heat the desired target while not affecting other heat-sens...
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