| 避免发生芯片裂纹的倒装片BGA技术概述 |
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| 引用本文： | 杨建生,徐元斌,李红.避免发生芯片裂纹的倒装片BGA技术概述[J].电子产品可靠性与环境试验,2002(1):62-66. |
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| 作者姓名： | 杨建生 徐元斌 李红 |
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| 作者单位： | 甘肃天水永红器材厂,甘肃,天水,741000 |
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| 摘 要： | 介绍了把断裂力学法应用于倒装片BGA的设计方法。概述了一些关键的材料特性和封装尺寸对倒装片BGA芯片裂纹的影响作用，从而断定基板厚度和芯片厚度是倒装片BGA芯片发生裂纹的两个最重要的因素。
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| 关 键 词： | BGA技术 球栅陈列封装 裂纹 芯片 有限单元分析 倒装片 断裂力学 设计工艺 |
| 修稿时间： | 2001年9月13日 |
Research for Flip - Chip BGA Technology to Avoid Cracking |
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| YANG Jian - sheng,XU yuang - bin,LI Hong.Research for Flip - Chip BGA Technology to Avoid Cracking[J].Electronic Product Reliability and Environmental Testing,2002(1):62-66. |
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| Authors: | YANG Jian - sheng XU yuang - bin LI Hong |
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| Abstract: | In this article fracture mechanics is applied to flip - chip BGA design technology to averting die cracking from its backside. Fracture mechanics is integrated with the finite element analysis(FEA) and design of virtual experiments to analyze the effects of location and length of a die crack, and the effects of some key material properties and package dimensions on die cracking of flip - chip BGA. It is concluded that substrate and die thickness are the two most significant factors to die cracking of flip - chip BGA. |
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| Keywords: | BGA crack die FEA flip - chip fracture mechanics design methodology |
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