| 高强度导电铜基材料的研究现状与发展前景 |
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| 引用本文： | 刘京雷,阮锋,王尔德,刘祖岩.高强度导电铜基材料的研究现状与发展前景[J].材料导报,2005,19(7):8-11. |
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| 作者姓名： | 刘京雷 阮锋 王尔德 刘祖岩 |
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| 作者单位： | 华南理工大学机械工程学院,广州,510640;哈尔滨工业大学材料科学与工程学院,哈尔滨,150001 |
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| 摘 要： | 简述了高强度导电铜基材料的设计思路,分析了时效强化、颗粒强化以及形变复合等3类铜基材料的制备方法和特点,综述了高强度导电铜基材料的研究现状,并展望了其进一步发展的趋势.
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| 关 键 词： | 铜基材料 导电材料 形变复合 制备方法 |
Progress in Research on High-strength and High-conductivity Copper-matrix Material |
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| LIU Jinglei,Ruan Feng,Wang Erde,Liu Zuyan.Progress in Research on High-strength and High-conductivity Copper-matrix Material[J].Materials Review,2005,19(7):8-11. |
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| Authors: | LIU Jinglei Ruan Feng Wang Erde Liu Zuyan |
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| Abstract: | Design consideration of high-strength and high-conductivity copper-matrix material is de- scribed.Fabrication process and property characters of copper-matrix materials,typed as aging strengthening,disper- sion strengthening and deformation processed composite materials are analyzed.The present research and development prospect are reviewed. |
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| Keywords: | copper-matrix material electrical material deformation processed composite fabrication process |
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