自动铺带铺层贴合形成机制

探讨了自动铺带工艺过程中相邻铺层界面间的贴合形成机制，将铺层界面间贴合过程建模为树脂补片在平行板之间挤压流动从而浸润界面的过程。指出在树脂流体黏度一定的情况下，树脂对界面浸润效果越好，则界面贴合能力越强。利用流体力学理论推导出树脂流体对界面浸润效果的计算公式，并分析了铺放压力、铺放速度等因素对浸润效果以及贴合能力的影响，提出以剥离力作为量化铺层间贴合能力的指标。在自行研制的自动铺带工艺参数实验平台上进行了一系列实验，实验结果表明，铺层间贴合能力随铺放速度增大而变差，随铺放压力、模具温度、压辊半径增大而变强，这一规律验证了所提出的树脂流体对界面浸润效果计算公式的正确性。

Bonding mechanism of ply during automated tape laying process

The bonding mechanism of adjacent plies during the tap laying process was discussed, and the bonding process was modeled as squeezing flow of resin patch under parallel plate. It is pointed out that when the viscosity of resin is constant, the bonding capability will become stronger when infiltration effect of the interface becomes better. The calculation formula of the infiltration effect was deduced by using fluid mechanics theory. Influence of main processing parameters (layup pressure, layup velocity, etc.) on infiltration effect and bonding capability was analyzed. The peel force was used to quantify the bonding capability of the ply. A series of experiments were carried out on the automated tape laying platform. It is shown that the bonding capability will become weaker as the layup velocity increases, and become stronger as layup pressure, mould temperature and roller radius increase. This law conforms to the calculation formula of the infiltration effect.