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| 银基合金研究现状与发展趋势 | |
| 引用本文： | 吴春萍,易丹青,许灿辉,周孑民,瓮桅. 银基合金研究现状与发展趋势[J]. 电工材料, 2012, 0(2): 1-8 |
| 作者姓名： | 吴春萍 易丹青 许灿辉 周孑民 瓮桅 |
| 作者单位： | 1. 中南大学材料科学与工程学院有色金属材料科学与工程教育部重点实验室,长沙410083 2. 中南大学能源科学与工程学院,长沙410083 3. 福达合金材料股份有限公司,浙江温州325025 |
| 基金项目： | 中央高校基本科研业务费专项资金资助(2012QNZT003);国家“十一五”科技支撑计划课题(2006BAE03B03);广东省教育部产学研结合项目(2006D90404015) |
| 摘 要： | 综述了银基电触头材料、银钎料、抗变色银合金和银基电子浆料的种类、制备工艺、合金元素的影响以及国内外研究现状,并阐述了四类银合金今后的发展趋势 |
| 关 键 词： | 银基电触头材料 银钎料 抗变色银合金 银基电子浆料 |
Present Research Situation and Development Trend of Silver Alloys |
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| WU Chun-ping,YI Dan-qing,XU Can-hui,ZHOU Jie-min,WENG Wei. Present Research Situation and Development Trend of Silver Alloys[J]. Electrical Engineering Materials, 2012, 0(2): 1-8 | |
| Authors: | WU Chun-ping YI Dan-qing XU Can-hui ZHOU Jie-min WENG Wei |
| Affiliation: | 1.Key Laboratory for Nonferrous Metal Materials of the Ministry of Education,School of Materials Science and Engineering,Central South University,Changsha 410083,China;2.School of Energy Science and Engineering,Central South University,Changsha 410083,China;3.Fuda Alloy Materials Co.Ltd.,Zhejiang Wenzhou 325025,China) |
| Abstract: | Silver and silver alloys have very important application value in industry.Types,fabrication technology,alloy agent’s effect of silver-based contact materials,solder,paste and anti-tainish silver alloy are introduced in present paper.In addition,the present situation and perspectives of silver alloy are represented. |
| Keywords: | silver-based contact materials silver-based solder anti-tarnish silver alloy silver-based paste |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |