| 挠性电路板紫外激光切割技术研究与突破 |
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| 引用本文： | 宋刘洋,梁前,吴伟钦. 挠性电路板紫外激光切割技术研究与突破[J]. 印制电路信息, 2010, 0(Z1): 183-189 |
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| 作者姓名： | 宋刘洋 梁前 吴伟钦 |
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| 作者单位： | 广东正业科技股份有限公司 |
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| 摘 要： | 文章阐述了国内外激光切割行业技术水平现状,激光加工技术在中国的广阔市场,介绍紫外(UV)激光切割系统的结构及运动控制原理,论述爱思达紫外激光切割机在碳化处理和切割效率上等取得的技术突破及其所带来的深远意义。
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| 关 键 词： | 紫外激光切割 挠性电路板 碳化 效率 涨缩系数补偿 |
The research and breakthroughs of the UV laser cutting technology in flexible printed circuit industry |
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| SONG Liu-yang,LIANG Qian,WU Wei-qin. The research and breakthroughs of the UV laser cutting technology in flexible printed circuit industry[J]. Printed Circuit Information, 2010, 0(Z1): 183-189 |
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| Authors: | SONG Liu-yang LIANG Qian WU Wei-qin |
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| Affiliation: | SONG Liu-yang LIANG Qian WU Wei-qin |
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| Abstract: | This paper described the wide application in the field of laser cutting both in country and abroad,and introduced the integrated structure and the controlling technique of workbench movement and galvanometer scanning of laser machine.With the far-reaching foreground of laser cutting industry,the breakthroughs of several key technologies of our company plays an important role in laser cutting industry in country. |
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| Keywords: | UV laser cutting FPC Carbonization Efficiency Compensation of expansion coefficient |
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