负热膨胀填料钨酸锆对环氧封装材料性能影响

由于封装材料与电子元件线膨胀系数差异大,成型后造成开裂、空洞和离层等缺陷,采用化学固相分步法制备的高纯度负热膨胀材料钨酸锆(ZrW2O8)颗粒作为填料,制备ZrW2O8/E-51及SiO2/E-51电子封装材料,测试了不同种类和含量的填料下封装材料线膨胀系数、显微硬度、玻璃化转变温度及磨损性能。实验结果表明:随ZrW2O8含量的增加,ZrW2O8/E-51材料线膨胀系数不断下降,显微硬度不断提高。ZrW2O8/E-51材料的磨损性能优于SiO2/E-51材料,磨损机理主要是粘着磨损和疲劳剥落,后期发生了磨粒磨损。

Effect of negative thermal expansion filler zirconium tungstate on epoxy electronic packages

The quite different linear expansion coefficient between packaging materials and electronic components caused the products defects of cracks,voids and exfoliation.Negative thermal expansion material ZrW2O8 powders were synthesized using solid-state reaction to overcome the defects above.The preparation and kinetics of epoxy resin electronic casting using different contents of ZrW2O8 and SiO2 as fillers were studied.Linear expansion coefficient,microscopic hardness,glass-transition temperature and wear properties of the composites were investigated.The results showed that,with the increasing of ZrW2O8 content,the linear expansion coefficient of ZrW2O8/E-51 composites decreased continuously and the mic-hardness increased.The wear mechanism of epoxy packaging materials was adherence abrasion and abrasive wear.