| TC4的激光焊接工艺研究 |
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| 引用本文： | 姜伟,胡芳友,沈国瑾.TC4的激光焊接工艺研究[J].现代制造工程,2007(8):74-75. |
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| 作者姓名： | 姜伟 胡芳友 沈国瑾 |
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| 作者单位： | 海军航空工程学院青岛分院,青岛,266041 |
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| 摘 要： | 以TC4为基体,研究工艺参数对激光焊接区域显微组织的影响,测试焊接区域和基体的显微硬度,获得了热影响区窄,焊缝组织细小致密,显微硬度明显高于基体且内部无气孔、裂纹等缺陷的焊接试样.
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| 关 键 词： | 激光焊接 TC4 工艺参数 显微组织 显微硬度 激光 焊接工艺研究 laser welding technology 焊接试样 缺陷 裂纹 气孔 组织细小 焊缝 热影响区 显微硬度 测试 显微组织 焊接区域 工艺参数 基体 |
| 文章编号： | 1671-3133(2007)08-0074-03 |
| 修稿时间： | 2006年11月20 |
Research on technology of laser welding of TC4 |
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| Jiang Wei,Hu Fang-you,Shen Guo-jin.Research on technology of laser welding of TC4[J].Modern Manufacturing Engineering,2007(8):74-75. |
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| Authors: | Jiang Wei Hu Fang-you Shen Guo-jin |
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| Abstract: | Based on TC4,the influence to microstructure of laser welding layer by laser welding parameters is studied and the micro-hardness of laser welding layer and substrate is tested.The sample whose microstructure is fine and compact and whose micro-hardness is higher than that of the substrate obviously can be obtained with narrow heat-affected zone and without cracks and porosities. |
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| Keywords: | Laser welding TC4 Parameters Microstructure Micro-hardness |
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