| 柔性基板BGA组装技术 |
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| 引用本文： | 郑大安. 柔性基板BGA组装技术[J]. 电子工艺技术, 2012, 0(6): 344-346,368 |
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| 作者姓名： | 郑大安 |
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| 作者单位： | [1]桂林电子科技大学,广西桂林541004 [2]中国西南电子技术研究所,四川成都610036 |
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| 摘 要： | 针对柔性基板易于弯曲、卷曲和扭转等特点影响BGA组装的问题,通过对柔性基板上BGA组装的工艺技术及可靠性保障技术等研究,确定了局部增厚提高可靠性,通过丝印模板和托板技术的应用,解决组装的平整性,实现了柔性基板上BGA器件组装技术。
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| 关 键 词： | 柔性基板 组装技术 可靠性分析 |
Technology of Assembling BGA Component based on FPCB |
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| ZHENG Da-an. Technology of Assembling BGA Component based on FPCB[J]. Electronics Process Technology, 2012, 0(6): 344-346,368 |
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| Authors: | ZHENG Da-an |
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| Affiliation: | ZHENG Da-an(1.Guilin University of Electronic Technology1,Guilin 541004,China 2.No.10 institute of CETC,Chengdu 610036,China) |
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| Abstract: | The flexible substrate is easy to bend,Curl and twist,which can affect the BGA assembling.Based on the flexible substrate BGA assembly technology and reliability technology research,identified a localized thickening to improve reliability,solved the coplanarity problem during assembly by screen printing technology and the supporting technology,and complete the BGA assembly on flexible substrate. |
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| Keywords: | Flexible substrate Assembly Reliability |
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