聚硫醚改性环氧树脂室温固化耐高温结构胶粘剂

目前室温固化耐高温环氧树脂结构胶粘剂主要采用液体端羧基丁腈橡胶增韧环氧树脂为主体,以改性液体端胺基丁腈橡胶或聚醚胺为韧性固化剂,其最高使用温度仅120℃。聚硫橡胶作为环氧树脂增韧剂和固化剂则由于耐热性能和增韧效果差,很少用于室温固化耐热环氧树脂结构胶粘剂。通过改进聚硫橡胶的内聚强度和耐热性能,作为增韧剂,克服了聚硫橡胶耐热性能和增韧效果差的缺点,大大地提高了室温固化环氧树脂结构胶粘剂的剥离强度,通过BMI与脂肪胺加成反应,并加入叔胺固化剂,合成具有BMI结构和叔胺的固化剂,以及加入有机硅改性石棉,使室温固化环氧树脂结构胶粘剂的耐热性能达到177℃,瞬间使用温度达300℃,达到室温固化高温使用的目的。

Heat-resistant modification epoxy construction adhesive curing at room temperature

Modification epoxy heat -resistant constructional adhesive cured at room temperature often concludes: CTBN modification epoxy resin ;ATBN or polyetheramine modification curing agent. The adhesive can be used at 120℃for long period. But polysulfide rubber is not used in modification epoxy resin heat-resistant constructional adhesive curing at room temperature,because it is bad in heat-resistant property. But in this paper,a kind of epoxy heat -resistant constructional adhesive cured at room temperature using modification polyalkylenesulfide is introduced. Curing agent is synthesized with BMI, aliphaticamide and midazolyl. The inorganic/organic polymer filling is synthesized with organosilicon polymer and asbestos. After cured at room temperature for 7 day,the adhesive can be used at 177℃for long period in aerospace and airplane industry.