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Tribological behaviour and residual stress of electrodeposited Ni/Cu multilayer films on stainless steel substrate
Authors:S.K. Ghosh  P.K. Limaye  N.L. Soni  R.O. Dusane
Affiliation:a Materials Processing Division, Bhabha Atomic Research Centre, Trombay, Mumbai-400 085, India
b Refuelling Technology Division, Bhabha Atomic Research Centre, Trombay, Mumbai-400 085, India
c Department of Metallurgical Engineering and Materials Science, Indian Institute of Technology Bombay, Powai, Mumbai-400 076, India
Abstract:In the present study, [Ni (4.5 nm)/Cu (tCu = 2, 4 and 8 nm)] multilayers were pulse electrodeposited on stainless steel (AISI SS 304) substrate from sulphate based single bath technique. X-ray diffraction (XRD) was used to investigate the structure and stress of the Ni/Cu multilayer. The results from XRD analysis indicated that the deposited multilayers had a preferred crystal orientation of [111] and presence of satellite reflection suggested the formation of superlattice. The stress level within the deposited multilayers was found to be sensitive to the sublayer thickness. Sliding wear behaviour of electrodeposited Ni/Cu multilayer films has been investigated against a tungsten carbide (WC) ball as the counter body and compared with that of the constituents, Cu and Ni coatings. The wear tests were carried out by using a reciprocating ball-on-flat geometry at translation frequencies of 5 and 10 Hz, slip amplitude of 1 mm and at five different loads of 3, 5, 7, 9 and 11 N. Friction force was recorded on-line during the tests. At the end of the tests, the wear scars were examined by laser surface profilometry and scanning electron microscopy (SEM). Friction coefficient was found to be dependent on load and Cu layer thickness (tCu) and the values for multilayers were border between Ni and Cu. Among multilayers, sample with minimum tCu has shown the lowest friction coefficient and wear rate. With increasing tCu, the wear mechanism changes from pure abrasive wear at tCu = 2 nm, to particle entrapment at tCu = 4 nm to particle embedding at tCu = 8 nm. Detailed investigation of the wear scar morphology as well as wear rate measurement revealed that at low loads, (H/E) ratio and residual stress governed the wear rate and the principle wear mode was abrasive cutting. At intermediate loads, the role of residual stress became insignificant while wear was governed by (H/E) ratio and plastic deformation. However, at higher loads, plastic deformation played the major role.
Keywords:Ni/Cu multilayers   Residual stress   XRD   Electrodeposition   Coefficient of friction   Wear   Tribology
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