| 酸性化学镀Ni-W-P合金镀层工艺研究 |
| |
| 引用本文： | 欧昌亚. 酸性化学镀Ni-W-P合金镀层工艺研究[J]. 涂料涂装与电镀, 2005, 3(4): 32-34 |
| |
| 作者姓名： | 欧昌亚 |
| |
| 作者单位： | 四川成都,610051 |
| |
| 摘 要： | 酸性化学镀Ni—W—P合金的可能性判定，探索次亚磷酸钠在酸性介质中将WO4^2-还原成W的机理，寻找在施镀条件下使W-O键松驰、断裂的催化剂，实现化学镀Ni—W—P合金镀层的生产应用。
|
| 关 键 词： | 酸性化学镀，Ni—W—P舍金，应用技术 酸性化学镀 合金镀层 Ni-W-P 工艺研究 化学镀Ni 次亚磷酸钠 酸性介质 生产应用 可能性 |
| 收稿时间： | 2005-03-10 |
The Technics Research of Acidity Chemical Plating Ni-W-P Alloy Plating Layer |
| |
| Ou ChangYa. The Technics Research of Acidity Chemical Plating Ni-W-P Alloy Plating Layer[J]. Coatings Painting & Electroplating, 2005, 3(4): 32-34 |
| |
| Authors: | Ou ChangYa |
| |
| Abstract: | The possibility determinant of acidity chemical plating Ni - W - P alloy, explore sodium hypophosphite making WO4^2- revert to W mechanism in acid medium, look for the activator making W - 0 key loosen, rupture under applying plating condition, carry, out the production appliment of chemical plating Ni - W - P alloy plating layer. |
| |
| Keywords: | acid chemical plating Ni - W - P alloy application technology |
| 本文献已被 维普 等数据库收录！ |
