| Fabrication of thick BOX SOI by Smart-cut technology |
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| 作者姓名： | WU Yan-Jun ZHANG Miao AN Zheng-Hua LIN Cheng-Lu |
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| 作者单位： | State Key Laboratory of Functional Materials for Informatics，Shanghai Institute of Microsystem and Information Technology，the Chinese Academy of Sciences，Shanghai 200050 |
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| 基金项目： | Supported by the National Natural Science Foundation of China(No.69906005)and the Shanghai Youth Foundation(No.01 QMH1403) |
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| 摘 要： | A SOI material with thick BOX (2.2 μm) was successfully fabricated using the Smart-cut technology. The thick BOX SOI microstructures were investigated by high resolution cross-sectional transmission electron mi-croscopy (XTEM), while the electrical properties were studied by the spreading resistance profile (SRP). Experimen-tal results demonstrate that both structural and electrical properties of the SOI structure are very good.
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Fabrication of thick BOX SOI by Smart-cut technology |
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| WU Yan-Jun,ZHANG Miao,AN Zheng-Hua,LIN Cheng-Lu.Fabrication of thick BOX SOI by Smart-cut technology[J].Nuclear Science and Techniques,2003,14(2). |
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| Authors: | WU Yan-jun ZHANG Miao AN Zheng-hua LIN Cheng-lu |
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| Abstract: | A SOI material with thick BOX (2.2 μm) was successfully fabricated using the Smart-cut technology. The thick BOX SOI microstructures were investigated by high resolution cross-sectional transmission electron microscopy (XTEM), while the electrical properties were studied by the spreading resistance profile (SRP). Experimental results demonstrate that both structural and electrical properties of the SOI structure are very good. |
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| Keywords: | SOI Thick BOX Smart-cut |
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