| 集成电路制造中的固结磨料化学机械抛光技术研究 |
| |
| 引用本文： | 苏建修,康仁科,郭东明,金洙吉,李秀娟.集成电路制造中的固结磨料化学机械抛光技术研究[J].润滑与密封,2005(3):1-4,8. |
| |
| 作者姓名： | 苏建修 康仁科 郭东明 金洙吉 李秀娟 |
| |
| 作者单位： | 大连理工大学精密与特种加工教育部重点实验室,辽宁,大连,116024 |
| |
| 基金项目： | 国家自然科学基金重大资助项目(50390061). |
| |
| 摘 要： | 经过对传统化学机械抛光技术的研究与分析，指出了目前ULSI制造中使用的传统化学机械抛光技术的缺点，通过对固结磨料化学机械抛光中的抛光垫结构、抛光机原理及抛光液的分析，得出了固结磨料化学饥械抛光技术的优点，同时还对硅片固结磨料化学机械抛光的缺陷进行了研究。
|
| 关 键 词： | 抛光技术 集成电路制造 磨料 固结 化学机械抛光 ULSI 抛光垫 抛光液 抛光机 传统 |
| 文章编号： | 0254-0150(2005)3-001-4 |
Study on Fixed-abrasive Chemical-mechanical Polishing Technology of Wafer in Integrate Circuit Manufacturing |
| |
| Su Jianxiu,Kang Renke,Guo Dongming,Jin Zhuji,Li Xiujuan.Study on Fixed-abrasive Chemical-mechanical Polishing Technology of Wafer in Integrate Circuit Manufacturing[J].Lubrication Engineering,2005(3):1-4,8. |
| |
| Authors: | Su Jianxiu Kang Renke Guo Dongming Jin Zhuji Li Xiujuan |
| |
| Abstract: | By analyzing and studying the conventional chemical mechanical polishing (CMP) technology,the defects of conventional CMP,used in ultra-large scale integrated (ULSI) nowadays,were pointed out.According to the analysis of the structure of polishing pad,polishing machine and polishing slurry,the merits of fixed abrasives (FA)CMP were presented.In the mean time,the defectivities produced in FA-CMP process were introduced. |
| |
| Keywords: | chemical-mechanical polishing fixed abrasives polishing pad polishing machine polishing slurry |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
