| 室温固化导热阻燃有机硅电子灌封胶的制备及性能研究 |
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| 引用本文： | 陈精华,李国一,胡新嵩,林晓丹,曾幸荣.室温固化导热阻燃有机硅电子灌封胶的制备及性能研究[J].材料导报,2011,25(8):1-4,11. |
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| 作者姓名： | 陈精华 李国一 胡新嵩 林晓丹 曾幸荣 |
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| 作者单位： | 华南理工大学材料科学与工程学院;广州市高士实业有限公司; |
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| 基金项目： | 粤港关键领域重点突破项目(2008A092000002); 广州市科技计划项目(09A41010915) |
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| 摘 要： | 以不同粘度端乙烯基硅油复配体系为基础胶,含氢硅油为交联剂,氧化铝为导热填料,氢氧化铝为阻燃剂,制备了具有良好导热、阻燃性能的可室温固化的有机硅电子灌封胶。研究了基础胶的乙烯基含量、含氢硅油活性氢含量、填料表面处理用偶联剂种类及用量、氧化铝(Al2O3)与氢氧化铝(Al(OH)3)用量对电子灌封胶性能的影响。结果表明,当以质量比为1∶1的SiVi-300(300mPa.s)和SiVi-1000(1000mPa.s)为基础胶、活性氢质量分数为0.22%的含氢硅油为交联剂、偶联剂KH570为填料表面处理剂(用量为填料量的0.5%(质量分数))、基本配方为m(基础胶)∶m(Al2O3)∶m(Al(OH)3)=100∶140∶60时,电子灌封胶的粘度为3900mPa.s,导热系数为0.72W/(m.K),阻燃性能达到UL 94-V0级,力学性能较佳,电学性能优良,具有最好的综合性能。
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| 关 键 词： | 导热 阻燃 电子灌封胶 有机硅 室温固化 |
Preparation and Properties of Room Temperature Vulcanizing Silicone Encapsulant with Thermal Conductivity and Flame Retardance |
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| CHEN Jinghua,LI Guoyi,HU Xinsong,LIN Xiaodan,ZENG Xingrong.Preparation and Properties of Room Temperature Vulcanizing Silicone Encapsulant with Thermal Conductivity and Flame Retardance[J].Materials Review,2011,25(8):1-4,11. |
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| Authors: | CHEN Jinghua LI Guoyi HU Xinsong LIN Xiaodan ZENG Xingrong |
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| Affiliation: | CHEN Jinghua1,LI Guoyi1,HU Xinsong2,LIN Xiaodan1,ZENG Xingrong1(1 College of Materials Science and Engineering,South China University of Technology,Guangzhou 510450,2 Guangzhou Glorystar Chemical Co.Ltd,Guangzhou 510640) |
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| Abstract: | Room temperature vulcanizing silicone encapsulant with thermal conductivity and flame retardance was prepared with vinyl end silicone oil mixture as basic gum,organohydrogenpolysiloxane as crosslinking agent,Al2O3 as thermal conductive filler and Al(OH)3 as flame retardant.The influence of vinyl content of basic gum,reactive hydrogen content of organohydrogenpolysiloxane,kind and dosage of the surface treatment agent,ratio of Al2O3 and Al(OH)3 on properties of silicone encapsulate were investigated.The resu... |
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| Keywords: | thermal conductivity flame retardance electronic encapsulant silicone room temperature wuleanizing |
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