| 一种制备硅通孔电镜测试样品的新方法 |
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| 引用本文： | 张茂盛,缪旻,于肇贤. 一种制备硅通孔电镜测试样品的新方法[J]. 北京机械工业学院学报, 2011, 0(2): 45-47 |
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| 作者姓名： | 张茂盛 缪旻 于肇贤 |
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| 作者单位： | 北京信息科技大学理学院;北京信息科技大学光电信息与通信工程学院; |
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| 基金项目： | 国家高技术研究发展计划项目(863计划,2007AA04Z352); 国家科技重大专项项目(2009ZX02038); 国家自然科学基金项目(60976083,60501007); 北京市自然科学基金项目(3102014) |
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| 摘 要： | 从硅通孔工艺质量检测角度出发,针对测试样品制备中存在的问题,提出了一种独特的电镜样品制备方法。该方法与聚焦离子束切割技术制作样品方法相比,降低了试样的拟作成本和制作时间。用于观察薄样横截面的电镜样品制备方法在其他领域也具有一定的参考价值。
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| 关 键 词： | 三维封装 硅通孔 芯片叠层 扫描电子显微镜 |
Specimen preparation for electron microscopy observation on through-silicon-via |
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| ZHANG Mao-sheng,MIAO Min,YU Zhao-xian. Specimen preparation for electron microscopy observation on through-silicon-via[J]. Journal of Beijing Institute of Machinery, 2011, 0(2): 45-47 |
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| Authors: | ZHANG Mao-sheng MIAO Min YU Zhao-xian |
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| Affiliation: | ZHANG Mao-sheng1,MIAO Min2,YU Zhao-xian1(1.School of Applied Sciences,Beijing Information Science and Technology University,Beijing 100192,China,2.School of Photoelectric Information and Telecommunication Engineering,China) |
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| Abstract: | In terms of imperfections in the fabrication process and quality inspect of TSV technology,a unique preparation method of sample for scanning electron microscope has been proposed from the perspective of technological quality examination.This method dramatically decreases the cost and time for specimen preparation,compared with the focused ion beam technology commonly used in integrated circuit industry.The preparation method of thin sample for cross-section electron microscopy observation,as we proposed,is... |
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| Keywords: | 3D integration through-silicon-via die stacking scanning election microscopy |
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