| 无铅钎料的研究开发现状 |
| |
| 引用本文： | 梁文杰,彭红建. 无铅钎料的研究开发现状[J]. 材料导报, 2011, 25(7): 127-130,144 |
| |
| 作者姓名： | 梁文杰 彭红建 |
| |
| 作者单位： | 中南大学化学化工学院,长沙,410083 |
| |
| 基金项目： | 湖南省科技计划项目(2009GK3152); 中南大学博士后基金资助项目 |
| |
| 摘 要： | 综述了近年来国内外无铅钎料的研究开发现状和部分无铅钎料的应用情况。重点介绍了国内外Sn-Ag和Sn-Zn系无铅钎料的研究与发展,以及合金元素对Sn-Ag和Sn-Zn系无铅钎料的微观组织、润湿性、熔点、腐蚀行为等方面的影响,并介绍了微量稀土元素对无铅钎料的组织和性能的影响。
|
| 关 键 词： | 无铅钎料 金属材料 现状 |
Current Research and Development of Lead-free Solder |
| |
| LIANG Wenjie,PENG Hongjian. Current Research and Development of Lead-free Solder[J]. Materials Review, 2011, 25(7): 127-130,144 |
| |
| Authors: | LIANG Wenjie PENG Hongjian |
| |
| Affiliation: | LIANG Wenjie,PENG Hongjian(School of Chemistry and Chemical Engineering,Central South University,Changsha 410083) |
| |
| Abstract: | The recent research and application of lead-free solder at home and abroad are reviewed.The research and development of main lead-free solder series of Sn-Ag and Sn-Zn,and the effect of alloy elements on microstructure,wettability,melting point and corrosion behavior of Sn-Ag and Sn-Zn are introduced in detail.The effect of rare earth elements on properties of lead-free solder is also introduced. |
| |
| Keywords: | lead-free solder metal materials status |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
