| 多次级高压变压器的分布电容 |
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| 引用本文： | 谢飞燕,张灵迪.多次级高压变压器的分布电容[J].物联网技术,2012(2):36-38. |
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| 作者姓名： | 谢飞燕 张灵迪 |
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| 作者单位： | 电子科技大学电子薄膜与集成器件国家重点实验室 |
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| 摘 要： | 分布电容是多次级高压变压器固有的寄生参数,它直接影响电路的工作性能。本文从分布电容的产生机理出发,通过传统绕制和PCB迭绕两种工艺的比较,最后以实测波形来说明了分布电容对电路性能的影响。
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| 关 键 词： | 分布电容 多次级高压变压器 传统绕制 PCB迭绕 |
Distributed capacitance of multi-level high-voltage transformer |
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| XIE Fei-yan, ZHANG Ling-di.Distributed capacitance of multi-level high-voltage transformer[J].Internet of things technologies,2012(2):36-38. |
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| Authors: | XIE Fei-yan ZHANG Ling-di |
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| Affiliation: | (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China) |
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| Abstract: | The distributed capacitance is inherent in the multi-level high-voltage transformer parasitic parameters, which directly affects the circuit performance. According to the generation mechanism of distributed capacitance, through comparing the traditional method of winding and the technology of PCB Diego around, the measured waveform is used to illustrate the influence of distributed capacitance on circuit performance. |
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| Keywords: | distributed capacitance multi-level high-voltage transformer traditional winding PCB Diego around |
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