Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys |
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| Authors: | C M L Wu D Q Yu C M T Law L Wang |
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| Affiliation: | (1) Department of Physics and Materials Science, City University of Hong Kong, Hong Kong SAR;(2) Department of Materials Engineering, Dalian University of Technology, Dalian, People’s Republic of China |
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| Abstract: | The Sn-0.7%Cu alloy has been considered as a lead-free alternative to lead-tin alloys. In this work, various small amounts
of rare earth (RE) elements, which are mainly Ce and La, have been added to the Sn-0.7%Cu alloy to form new solder alloys.
It was found that the new alloys exhibit mechanical properties superior to that of the Sn-0.7%Cu alloy. In particular, the
addition of up to 0.5% of RE elements is found to refine the effective grain size and provide a fine and uniform distribution
of Cu6Sn5 in the solidified microstructure. Tensile, creep, and microhardness tests were conducted on the solder alloys. It was found
that significant improvements of the tensile strength, microhardness, and creep resistance were obtained with RE element addition.
Upon aging at 150°C for 20 h, the microstructure of Sn-Cu-RE is more stable than that of the Sn-Cu alloy. |
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| Keywords: | Tin-copper lead-free alloy Ce and La rare earth elements aging creep tensile strength |
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