Creep crack initiation at a free edge of an interface between submicron thick elements |
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| Authors: | Hiroyuki Hirakata Toshihiro Hirako Yoshimasa Takahashi Yasunori Matsuoka Takayuki Kitamura |
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| Affiliation: | 1. Department of Mechanical Engineering, Osaka University, Osaka 565-0871, Japan;2. Department of Mechanical Engineering and Science, Kyoto University, Kyoto 606-8501, Japan;1. School of Engineering, Edith Cowan University, 270 Joondalup Drive, Joondalup, Perth, WA 6027, Australia;2. Department of Materials Engineering, Shanghai Key Laboratory of Modern Metallurgy and Materials Processing, Shanghai University, 149 Yanchang Road, Shanghai 200072, China;1. Computational Solid Mechanics Laboratory, Division of Physical Sciences and Engineering, King Abdullah University of Science and Technology (KAUST), Saudi Arabia;2. Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, LE11 3TU, UK;1. Department of Mechanical Engineering, Global Academy of Technology, Bangalore-98;2. Department of Mechanical Engineering, RajaRajeswari College of Engineering, Bangalore-74 |
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| Abstract: | To clarify the mechanics of time-dependent crack initiation at an interface edge in submicron thick elements due to creep, delamination experiments are conducted using a micro-cantilever bend specimen with a tin/silicon interface edge. After the specimen time-dependently deforms under a constant load, a delamination crack is initiated at the Sn/Si interface edge. In addition, the steady state creep property of Sn is estimated by performing an inverse analysis using a finite element method based on creep deformation experiments conducted for different specimens. Stress analysis using the obtained creep property reveals that stress and strain rate singularities exist at the Sn/Si interface edge under creep deformation. The intensity of the singular field time-dependently increases as the creep region expands, and eventually it becomes a steady state. The stress and strain rate intensities at the steady state correlate well with the crack initiation life, which indicates that the singular stress field near the interface edge governs the creep crack initiation. |
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