基于LTCC腔体结构的新型微波多芯片组件研究

 传统的微波多芯片组件(MMCM)金属壳体气密封装存在需要增加重量、互连线和成本等缺点.采用低温共烧陶瓷(LTCC)腔体技术为MMCM研制提供了一种实现微波互连基板和封装外壳一体化的理想解决方案.本文采用微波分析软件对微波LTCC腔体及其过渡结构进行了仿真和优化,并与LTCC腔体试验样品的测试结果进行了对比,两者吻合较好.采用微波LTCC腔体技术研制成功一个X波段T/R组件接收支路.

Study on A Novel Microwave Multichip Module Based on LTCC Cavity Structure

The shortcomings of increasing weight,interconnecting lines and cost exist in traditional metal housing technique for hermetic packaging of microwave multichip modules(MMCMs).Low Temperature Co-fired Ceramics(LTCC)cavity technique is an excellent hermetic packaging solution to realize integration of microwave interconnecting substrate and packaging house for developing MMCMs.The microwave LTCC cavity structures and their transitions were simulated and optimized by the microwave analysis software in this paper.Good agreement was acquired between the simulated results and the experimental results.A X-band receive channel in transmit/receive(T/R) module was developed successful by LTCC cavity technique.