高速应用的薄膜MCM材料评述

信号频率在１００ＭＨｚ以上时，材料性质对薄膜多芯片组件（ＭＣＭ－Ｄ）的性能变得越来越重要。本文讨论高频下材料性质对ＭＣＭ－Ｄ的电性能的影响。着重讨论介电常数、介质损耗角正切、互连金属电阻和互连金属趋肤深度等对系统性能的影响。对常用的ＭＣＭ－Ｄ材料的这些性质作了比较。

Evaluation of Thin MCM Materials for High-Speed Applications

Material properties become an increasingly important part of thinfilm multichip module(MCM-D)performance as signal frequencies increase above 100MHz.This paper discusses the influence of materials properties on the electrical perfor-mance of MCM-D structures at high frequencies.Specifically,the paper discusses the im-pact on system performance of:dielectric constant,dielectric loss tangent,interconnectmetal resistance,and interconnect metal skin depth.These properties are compared forcommon MCM-D materials.