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IC表面钝化PECVD工艺的计算机模拟
引用本文:徐重阳,丁晖,王倓,邹雪城,张少强,冯汉华.IC表面钝化PECVD工艺的计算机模拟[J].电子学报,1998,26(5):26-29,59.
作者姓名:徐重阳  丁晖  王倓  邹雪城  张少强  冯汉华
作者单位:华中理工大学固体电子学系,武汉,430074
摘    要:本文介绍了一种新的工艺研究途径-神经网络反向传播算法(BP算法),并对其网络学习收敛速度的加快进行了讨论,取得了较好的效果;利用改进的神经网络BP算法,我们通过建立IC表面钝化工艺的神经网络模型,对IC表面钝化工艺进行了计算机模拟,精确地预报了实验结果并得到了相关工艺条件与钝化介质膜特性的关系曲线,所编写的神经网络应用程序已用C语言在计算机上得到了实现。

关 键 词:神经网络  反向传播算法(BP算法)  等离子体增强化学汽相淀积(PECVD)钝化工艺  计算机集成制造技术

Simulation of IC Surface Passivation PECVD Process
Xu Chongyang, Ding Hui,Wang Tan, Zou Xuecheng, Zhang Shaoqiang, Feng Hanhua.Simulation of IC Surface Passivation PECVD Process[J].Acta Electronica Sinica,1998,26(5):26-29,59.
Authors:Xu Chongyang  Ding Hui  Wang Tan  Zou Xuecheng  Zhang Shaoqiang  Feng Hanhua
Abstract:In this paper, a novel approach to study IC process-back propagation neural networks(BP neural networks)is introduced, and the improvement of network learning speed is discussed; We have used the improved BP neural networks to model IC surface passivation process and discover the exact nature of the relationship between film properties and controllable deposition conditions by computer simulation. The neural networks application programs using C language have been realized in computer.
Keywords:Neural networks  Back propagation algorithm  Plasma enhanced chemical vapor deposition (PECVD)  Passivation process  IC-CIM  
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