| 微电子封装与组装中的再流焊技术研究进展 |
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| 引用本文： | 田艳红,王春青.微电子封装与组装中的再流焊技术研究进展[J].焊接,2002(6):5-9. |
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| 作者姓名： | 田艳红 王春青 |
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| 作者单位： | 哈尔滨工业大学,150001 |
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| 摘 要： | 先进电子封装器件的出现推动了再流焊方法和设备的研究，简要介绍了集成电路器件封装的发展，并在正在普遍应用的几种再流焊方法进行了介绍和评述。着重阐述了一种极具潜力的再流焊方法－激光再流焊。
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| 关 键 词： | 微电子封装 再流焊 激光再流焊 集成电路 |
| 修稿时间： | 2002年1月30日 |
RESEARCH STATUS OF REFLOW SOLDERING TECHNOLOGY IN MICROELECTRONIC PACKAGING AND ASSEMBLY |
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| Harbin Institute of Technology Tian Yanhong,Wang Chunqing.RESEARCH STATUS OF REFLOW SOLDERING TECHNOLOGY IN MICROELECTRONIC PACKAGING AND ASSEMBLY[J].Welding & Joining,2002(6):5-9. |
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| Authors: | Harbin Institute of Technology Tian Yanhong Wang Chunqing |
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| Abstract: | Development of advanced electronic package devices promoted the study on the reflow soldering. In this paper, development of electronic packages was described briefly first, then the most popular reflow soldering methods were discussed. A potential reflow method-laser reflow soldering was expatiated in detail. |
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| Keywords: | electronic package reflow soldering laser reflow soldering |
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