| 基于FEA的Cu pad模型对焊点可靠性的影响分析 |
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| 引用本文： | 魏艳娟,谢劲松.基于FEA的Cu pad模型对焊点可靠性的影响分析[J].电子质量,2014(4):24-28. |
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| 作者姓名： | 魏艳娟 谢劲松 |
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| 作者单位： | 北京航空航天大学可靠性与系统工程学院,北京100191 |
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| 摘 要： | 随着集成电路封装技术的发展,器件焊点可靠性成为国内外研究的重点,该文介绍了影响BGA焊点可靠性的常见因素,并以一块电路板为例,构建带有焊点亚结构——Cu pad和无Cu pad的两种电路板模型,仿真分析热循环条件下Cu pad对焊点可靠性的影响,为整板简化建模提供参考意见。
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| 关 键 词： | Cu pad 焊点可靠性 有限元 BGA |
Analysis of the Influence of Cu Pad Model on the Solder Joint Reliability Based on the FEA |
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| Wei Yan-juan,Xie Jin-song.Analysis of the Influence of Cu Pad Model on the Solder Joint Reliability Based on the FEA[J].Electronics Quality,2014(4):24-28. |
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| Authors: | Wei Yan-juan Xie Jin-song |
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| Affiliation: | (Institution Of Reliability And System Engineering, Bei-hang University,Beijing 100191) |
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| Abstract: | Along with the development of the integrated circuit packaging technology,solder joint reliability become the focus of the research in the domestic and overseas,this paper introduces the common factors effecting the reliability of BGA solder joint,and we take a circuit board as a case,building two kinds of circuit board,one with solder joint substructure Cu pad,another without Cu pad.The influence of Cu pad on the sol- der joints reliability are analyzed through the simulation under thermal cycling conditions,provide reference for the simplified model of the whole board. |
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| Keywords: | Cu pad Solder Joint Reliability finite element BGA |
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