| 非晶态铜基无银钎焊料的应用试验研究 |
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| 引用本文： | 刘宏,郭荣新.非晶态铜基无银钎焊料的应用试验研究[J].山东轻工业学院学报,1999,13(1):55-59,80. |
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| 作者姓名： | 刘宏 郭荣新 |
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| 作者单位： | [1]山东轻工业学院机电工程系 [2]淄博市新材料研究所 |
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| 摘 要： | 非晶态铜基无银钎焊料是利用新的冶金手段制备的一种新型钎焊料。材料内部的原子排列有着奇异的与一般金属结晶不同的特殊结构状态。本文通过焊接试验研究，从焊接工艺效果、机械强度、导电性能等方面证明了这种新型钎焊料的优异特性。
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| 关 键 词： | 非晶态 铜基 无银钎焊料 成分 性能 钎焊料 |
Research on Eexperiments of the Application of Hard Solder of Noncrystalline and Non-silver Copper Base |
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| Liu Hong.Research on Eexperiments of the Application of Hard Solder of Noncrystalline and Non-silver Copper Base[J].Journal of Shandong Institute of Light Industry(Natural Science Edition),1999,13(1):55-59,80. |
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| Authors: | Liu Hong |
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| Abstract: | The hard solder of noncrystalline and nonsilver copper base is a new one prepared by a new method of metallurgy.The arrangement of atoms inside the material has a special state of structure.Through experiments in welding,the paper has proved its excellent properties from the effects of welding technology,mechanical strength to electric conductivity etc. |
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| Keywords: | hard solder of noncrystalline and non-silver copper base composition property replacing silver |
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