| 热处理工艺对AC PDP中MgO保护膜性能的影响 |
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| 引用本文： | 任红霞,胡江峰,郑德修.热处理工艺对AC PDP中MgO保护膜性能的影响[J].真空电子技术,1999(1):38-43. |
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| 作者姓名： | 任红霞 胡江峰 郑德修 |
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| 作者单位： | [1]西安电子科技大学微电子研究所 [2]西安交通大学电子物理与器件研究所 |
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| 摘 要： | 保护膜的表面特性严重影响ＡＣ ＰＤＰ的性能，本文以电子束蒸发法制得的ＭｇＯ保护膜为例，有关热处理条件对保护膜表面基本特性，如结晶结构，表面形貌及成分等的影响进行了研究。
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| 关 键 词： | 介质保护膜 热处理工艺 表面特性 AC PDP |
The Influence of Baking Process on the Characteristics of Protecting Film MgO in AC PDP |
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| Ren Hongxia.The Influence of Baking Process on the Characteristics of Protecting Film MgO in AC PDP[J].Vacuum Electronics,1999(1):38-43. |
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| Authors: | Ren Hongxia |
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| Abstract: | The properties of protecting layer can significantly affect the AC PDP performance.With MgO film deposited by electron beam evaporation as an example,the influence of baking condition on the basic characteristics of the protecting films is studied,these characteristics include the crystal structure,the surface appearance and the composition of the film. |
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| Keywords: | Protecting film overcoating the dielectric layer Baking process Surface characteristic |
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