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应用半导体制冷的冷藏链用储藏箱性能实验研究
引用本文:邱兰兰,王瑜,朱洁茹,鲍俊,刘金祥.应用半导体制冷的冷藏链用储藏箱性能实验研究[J].制冷学报,2020,41(1):131-140.
作者姓名:邱兰兰  王瑜  朱洁茹  鲍俊  刘金祥
作者单位:南京工业大学城市建设学院,南京工业大学城市建设学院,南京工业大学城市建设学院,南京工业大学城市建设学院,南京工业大学城市建设学院
基金项目:国家自然科学基金(51806096),江苏省高校自然科学基金(18KJB560007)和江苏省研究生科研与实践创新计划(SJCX18_0336)资助项目。
摘    要:半导体制冷片因其体积小、制冷速度快的优点在冷藏链运输领域具有很强的应用潜力。为测试半导体制冷箱的制冷效率,本文搭建了制冷储藏箱性能测试实验台,对应用两片TEC1-12706型及TEC1-12712型半导体制冷片的制冷储藏箱的工作性能进行实验研究。实验中分别在储藏箱中加入2 000 m L冰块开始实验及应用1 500 mL冰块与3 kg食材及3瓶500 mL矿泉水的组合开始实验,两次实验中同时改变热端散热方式及冷端风扇吹风方式。结果表明:对于同型号半导体制冷片,水冷方式时制冷效果更好,但持久性不强;同型号半导体制冷片冷端风扇下吹方式与侧吹方式相比气流组织更好。当容积为0. 1 m^3的储藏箱面向冷藏需求时,可应用两片采取热端风冷方式的TEC1-12706型半导体制冷片,此时10 h内箱体中心温度最大约为6℃,最小约为0℃;当容积为0. 1 m^3的储藏箱面向冷冻需求时,可应用两片TEC1-12712型半导体制冷片结合水冷式热端和风扇下吹式冷端,能维持3 h箱体内温度不高于0℃。

关 键 词:冷藏链  半导体制冷  制冷性能实验  温度场  运行工况
收稿时间:2018/9/17 0:00:00
修稿时间:2019/3/22 0:00:00

Experimental Research on the Performance of Storage Box with Semiconductor Refrigeration Applied in Cold Chain
Qiu Lanlan,Wang Yu,Zhu Jieru,Bao Jun and Liu Jinxiang.Experimental Research on the Performance of Storage Box with Semiconductor Refrigeration Applied in Cold Chain[J].Journal of Refrigeration,2020,41(1):131-140.
Authors:Qiu Lanlan  Wang Yu  Zhu Jieru  Bao Jun and Liu Jinxiang
Affiliation:College of Urban Construction, Nanjing Tech University,College of Urban Construction, Nanjing Tech University,College of Urban Construction, Nanjing Tech University,College of Urban Construction, Nanjing Tech University and College of Urban Construction, Nanjing Tech University
Abstract:Despite its small volume and quick refrigeration,semiconductor refrigeration plates have good application potential in refrigerated transportation. To examine the cooling capacity of the storage box with a semiconductor,an experimental bench was established to investigate the working performance of a storage box with two semiconductors types,namely,TEC1-12706 and TEC1-12712. The twice experiments started with 2 000 mL ice cubes and the combination with 1 500 mL ice cubes,3 kg foodstuffs,and 3 bottles of mineral water with a volume of 500 mL respectively in the storage box. Meanwhile,different heat dissipation method of the hot side and fan arrangement of the cold side were both considered during the test. The results show that the TEC1-12712 with water-cooling has a larger cooling capacity than the TEC1-12706 with air-cooling. Comparing the performance of same type of refrigeration chip using water and air-cooling,it was inferred that the water-cooling has a better cooling effect and a shorter resistance time. Moreover,a better airflow distribution appears when the fan is arranged below the cold side of the refrigeration chip rather than beside it. With the cold storage demand for a volume of 0.1 m^3,two chips of the TEC1-12706 type with air-cooling on the hot side are preferred. Over 10 hours,the center temperature of the box was maintained at 6 ℃ and the minimum value in the box was approximately 0 ℃ . With the freezing demand,two chips of type TEC1-12712 with water-cooling on the hot side and the fan below the cold side are preferred. With this application method,the center temperature is controlled below 0 ℃ within 3 hours.
Keywords:cold chain  semiconductor refrigeration  refrigeration performance test  temperature field  operating conditions
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