首页 | 本学科首页   官方微博 | 高级检索  
     


Monodisperse Polymer Capsules: Tailoring Size,Shell Thickness,and Hydrophobic Cargo Loading via Emulsion Templating
Authors:Jiwei Cui  Yajun Wang  Almar Postma  Jingcheng Hao  Leticia Hosta‐Rigau  Frank Caruso
Affiliation:1. Centre for Nanoscience and Nanotechnology (CNST) Department of Chemical and Biomolecular Engineering The University of Melbourne Parkville, Victoria 3010 (Australia);2. Key Laboratory of Colloid and Interface Chemistry of Ministry of Education Shandong University Jinan 250100 (China);3. CSIRO Molecular and Health Technologies Clayton, Victoria 3168 (Australia)
Abstract:The preparation of monodisperse polymer (polydopamine, PDA) capsules by a one‐step interfacial polymerization of dopamine onto dimethyldiethoxysilane (DMDES) emulsion droplets and removal of the DMDES templates with ethanol is reported. The diameters of the PDA capsules can be tailored from 400 nm to 2.4 µm by varying either the DMDES emulsion condensation time or the emulsion concentration used for templating. Further, capsules with defined nanometer‐scale shell thicknesses (ranging from ~10 to 30 nm) can be prepared by adjusting the emulsion concentration. This shell thickness can be increased by repeated interfacial polymerization of dopamine, with three cycles yielding capsules with a shell thickness of up to 140 nm (for a 0.6% v/v suspension). Functional substances, such as organically stabilized magnetic (Fe3O4) nanoparticles, quantum dots (CdSe/CdS), and hydrophobic drugs (thiocoraline), can be preloaded in the emulsion droplets, and following PDA coating and DMDES removal, these materials remain encapsulated in the polymer capsules. All of the unloaded and loaded PDA capsules are monodisperse and do not aggregate. This work provides new avenues for the preparation of polymer capsules with defined size and shell thickness and for the encapsulation of a range of hydrophobic substances.
Keywords:polymeric capsules  emulsion droplets  encapsulation  nanotechnology  drug delivery
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号