The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic solders |
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Authors: | Jae Yong Park Choon Sik Kang Jae Pil Jung |
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Affiliation: | (1) School of Materials Science & Engineering, Seoul National University, 151-742 Seoul, Korea;(2) Department of Materials Science & Engineering, Univ. of Seoul, 130-743 Seoul, Korea |
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Abstract: | To analyze the withdrawal force curve in the wetting balance curve, wetting balance tests using the 63Sn-37Pb and 96.5Sn-3.6Ag
eutectic solders were conducted by varying the immersion speed, sample perimeter, and solder temperature. The mechanism of
the withdrawal force curve was reviewed and a new method for calculating the surface tension of solders using the withdrawal
force curve was introduced. The results showed that the maximum point of the withdrawal force curve is generated when the
sliding solder meets the bottom corners of a sample and the contact angle is reduced to zero. The maximum withdrawal force
subtracted by end force can be expressed using force balance equation as F=pγ. Therefore, the surface tension of the solder
can be calculated by dividing the maximum withdrawal force by the sample parameter. |
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Keywords: | Wetting curve withdrawal force curve solder surface tension Sn-Pb Sn-Ag |
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