| 表面贴装技术手工操作工艺 |
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| 引用本文： | 孙美华.表面贴装技术手工操作工艺[J].半导体技术,2007,32(8):723-726. |
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| 作者姓名： | 孙美华 |
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| 作者单位： | 南通纺织职业技术学院,机电工程系,江苏,南通,226007 |
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| 摘 要： | 依据表面贴装技术(SMT)工业生产流程、SMT设备原理、表面贴装工程品质要求,提出了简便易行的表面贴装技术手工操作工艺方案,用SMT焊接技术来分析其工艺流程及工艺参数.介绍了表面贴装技术的工艺原理、工艺过程、手工操作方法及其特点,提供了表面贴装技术手工操作设备的配置、设计制作及使用方法,对印刷焊膏、表面贴装器件(SMD)贴装、回流焊接温度控制等关键工序提出了相应的品质要求和注意点,并对常见的焊接缺陷作了简单分析,解决了印制焊膏、贴装元器件、焊接、清洗、检测、返修等SMT焊接技术.
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| 关 键 词： | 表面贴装技术 焊膏 表面贴装器件 回流焊 |
| 文章编号： | 1003-353X（2007）08-0723-04 |
| 修稿时间： | 2007-02-15 |
Manual Operating Technology of SMT |
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| SUN Mei-hua.Manual Operating Technology of SMT[J].Semiconductor Technology,2007,32(8):723-726. |
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| Authors: | SUN Mei-hua |
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| Affiliation: | Department of Mechanical and Electrical Engineering, China |
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| Abstract: | According to the industrial product procedure and the apparatus theory of the SMT,the portable surface mounting technology and the craftwork design of manual operation were proposed.The craftwork procedure and parameter with SMT were analyzed.The craftwork theory,procedure,manual operation methods and features of SMT were introduced.The allocation,design product and usage method of SMT manual operation apparatus were provided.The corresponding quality requirements and key points of some critical procedures about printing jointing paste,SMD mounting and circumfluence jointing temperature control were elaborated.The common jointing defects was analyzed and some problems in SMT jointing technology were solved,such as printing jointing paste,pasting components,jointing,cleaning,checking,reconditioning and so on. |
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| Keywords: | SMT soldering paste SMD backflow soldering |
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