| Ti箔厚度对Si3N4/Ti/Cu/Ti/Si3N4部分瞬间液相连接界面结构及强度的影响 |
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| 引用本文： | 邹家生,翟建广,初雅杰,陈铮. Ti箔厚度对Si3N4/Ti/Cu/Ti/Si3N4部分瞬间液相连接界面结构及强度的影响[J]. 焊接学报, 2003, 24(6): 19-22 |
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| 作者姓名： | 邹家生 翟建广 初雅杰 陈铮 |
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| 作者单位： | 华东船舶工业学院,焊接系,江苏,镇江,212003 |
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| 基金项目： | 江苏省自然科学基金项目(BK201087) |
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| 摘 要： | 采用Ti／Cu／Ti中间层在l273K、180min的条件下，改变Ti箔厚度进行Si3N4陶瓷的部分瞬间液相(PTLP)连接，讨论Ti箔厚度对界面结构及连接接头强度的影响，用扫描电镜、电子探针对连接界面区域进行了分析。结果表明，在试验范围内，Ti箔厚度为10μm时Si3N4／Ti／Cu／Ti／Si3N4接头的室温强度最高，为210MPa。PTLP连接时，当连接温度和时间不变，且连接时间能保证等温凝固过程充分进行的条件下，Si3N4／Ti/Cu／Ti／Si3N4连接界面结构、反应层厚度、等温凝固层厚度随着Ti箔厚度改变而改变。
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| 关 键 词： | 部分瞬间液相连 钛箔厚度 陶瓷 界面结构 连接强度 |
| 文章编号： | 0253-360X(2003)06-19-04 |
| 收稿时间： | 2003-08-26 |
Effect of Ti foil thickness on interfacial structure and strength in PTLP bonding of Si3N4/Ti/Cu/Ti/Si3N4 |
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| ZOU Jia-sheng,ZHAI Jian-guang,CHU Ya-jie and CHEN Zheng. Effect of Ti foil thickness on interfacial structure and strength in PTLP bonding of Si3N4/Ti/Cu/Ti/Si3N4[J]. Transactions of The China Welding Institution, 2003, 24(6): 19-22 |
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| Authors: | ZOU Jia-sheng ZHAI Jian-guang CHU Ya-jie CHEN Zheng |
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| Affiliation: | Departement of Welding, East China Shipbuiilding Institute, Jiangsu Zhenjiang 212003, China,Departement of Welding, East China Shipbuiilding Institute, Jiangsu Zhenjiang 212003, China,Departement of Welding, East China Shipbuiilding Institute, Jiangsu Zhenjiang 212003, China and Departement of Welding, East China Shipbuiilding Institute, Jiangsu Zhenjiang 212003, China |
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| Abstract: | Partial transient liquid-phase bonding (PTLP bonding) of Si_3N_4 ceramic with Ti/Cu/Ti multi-interlayer was performed by changing the thickness of Ti foil.The effect of Ti foil thickness on interface structure and joint strength was discussed.The joint interfaces were analyzed by SEM and EPMA.The results show that under the experimental conditions high joint strengthen 210 MPa is obtained at room temperature.When bonding temperature and time was not changed and the process of isothermal solidification was carried completely,interface structure, reaction layer thickness and isothermal solidification thickness were changed with the change of Ti foil thickness. |
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| Keywords: | partial transient liquid phase bonding silicon nitride Ti foil thickness interfacial structure bonding strength |
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