Solder bonding with a buffer layer for MOEMS packaging using induction heating |
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Authors: | Hu Chao-Chang Wen Shih-Yi Hsu Chen-Peng Chang Chun-Wei Shih Chih-Tsung Lee Hsiao-Wen |
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Affiliation: | 1.Opto-Electronics and Systems Laboratories, Industrial Technology Research Institute, Rm. 505, Bldg. Yanjiou 1st, 31 Gongye 2nd Rd., Annan District, Tainan City, 709, Taiwan, ROC ; |
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Abstract: | In this paper, the selective induction heating technology is applied to glass–glass and glass–silicon solder bonding for MOEMS (optical MEMS) packaging. The Ni bumping with a buffer layer is successful to release the thermal stress for avoiding delamination. The Au wetting layer must be thick enough to prevent from being solved entirely into Sn, and it will improve bonding strength. The bonding specimens are soaked into 25°C water and placed into 85°C/85% RH oven, respectively. No moisture penetrates into the cavity after 1 day in both test conditions. In the test condition of 125°C leakage-test liquid (Galden HS260), no bubble is observed. The lowest bonding strength is 3 MPa. |
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