A dielectrophoretic chip packaged at wafer level |
| |
Authors: | Iliescu Ciprian Tay Francis E H Xu Guolin Yu Li Ming Samper Victor |
| |
Affiliation: | 1.Institute of Bioengineering and Nanotechnology, 31 Biopolis Way, The Nanos, #04-01, 138669, Singapore, Singapore ;2.Department of Mechanical Engineering, National University of Singapore, 10 Kent Ridge Crescent, 119260, Singapore, Singapore ; |
| |
Abstract: | The paper presents a dielectrophoretic chip, fully enclosed, with bulk silicon electrodes fabricated using wafer-to-wafer bonding techniques and packaged at the wafer level. The silicon electrodes, which are bonded to two glass dies, define in the same time the walls of the microfluidic channel. The device is fabricated from a silicon wafer that is bonded (at wafer level) anodically and using SU8 photoresist between two glass wafers. The first glass die includes drilled holes for inlet/outlet connections while the second glass die assure the electrical connections, through via holes and a metallization layer, between the silicon electrodes and a printing circuit board. |
| |
Keywords: | |
本文献已被 SpringerLink 等数据库收录! |
|