变温压差膨化干燥香菇脆片的工艺优化

为研究变温压差膨化技术在菌菇类产品深加工中的可行性,开发一种新型的即食类香菇休闲产品-香菇脆片。以香菇为原料,在停滞时间、膨化压力差、膨化温度、抽空温度、抽空时间、切片厚度6个单因素试验基础上,采用响应面分析法建立多元统计回归模型,对变温压差膨化干燥香菇脆片进行工艺优化。研究表明,变温压差膨化干燥香菇脆片的最佳工艺参数为:停滞时间12 min、膨化压力差0.2 MPa、膨化温度90℃、抽空时间68 min、抽空温度80℃、切片厚度7 mm。在此最佳工艺条件下进行验证得到变温压差膨化干燥香菇脆片的脆度814.73±19.80 g,硬度1962.76±33.55 g,感官评分97.10±2.40,与预测值极为接近,说明采用此模型对气流膨化香菇脆片进行优化具有可行性。

Optimization of Varying Temperature and Pressure Puffing Drying for Lentinus edodes Chips

In order to study the varying temperature and pressure puffing technology in the deep processing of mushroom products, a new kind of instant leisure food, Lentinus edodes chips, was developed. Based on six single factor experiments of residence time, puffing pressure difference, puffing temperature, vacuum temperature, vacuum time and slice thickness, a multivariate statistical regression model was established through the response surface methodology to optimize the varying temperature and pressure puffing drying for Lentinus edodes chips process.The results showed that the best processing conditions of the varying temperature and pressure puffing drying for Lentinus edodes chips were as follows:residence time 12 min, puffing pressure difference, 0.2 MPa, puffing temperature 90℃, vacuum time 68 min, vacuum temperature 80℃ and slice thickness 7 mm. Under the optimum condition, the brittleness of the varying temperature and pressure puffing drying for Lentinus edodes chips was 814.73 ±19.80 g, the hardness was 1962.76 ±33.55 g, and the sensory score was 97.10 ±2.40, which was very close to the prediction value.It could provide theoretical guidance and technical support for the the varying temperature and pressure puffing drying for Lentinus edodes chips.