基于等效阻抗的蓝宝石超声研磨工艺试验

由力电类比可知:超声研磨加工系统的等效阻抗可反映加工力,且二者呈正相关关系。加工系统的等效阻抗随着加工间隙的增加而减小,该加工间隙为串联谐振频率下工具平衡位置与工件之间的间隙。基于上述理论,采用等效阻抗的控制方法对蓝宝石进行超声研磨工艺试验,探索不同研磨参数对蓝宝石材料去除率及表面质量的影响,并简单对比了超声研磨与普通研磨的区别。结果表明:无论在材料去除率或表面质量方面,超声研磨均优于普通研磨。随着输出电流、阻抗阈值、研磨速度及研磨时间的增加,材料去除率均呈先增大、后减小的趋势,但增大的速度各不相同;表面质量呈先减小、后增大的趋势,且在某处存在最佳值。

Process Test of Ultrasonic Lapping Sapphire Based on Equivalent Impedance

Firstly,we can conclude that the equivalent impedance of ultrasonic grinding machining system can reflect the processing power by force electric analogy method ,and both of them are positively correlated. And then,machining system equivalent impedance increase with the machining gap decrease,which is form by workpiece and tool under the equilibrium position. So in order to explore the different grinding parameters effect on material removal rate and surface quality of sapphire and compare the advantage of ultrasonic lapping to traditional ultrasonic the process of ultrasonic lapping sapphire based on equivalent impedance were carried out. The results show that ultrasonic lapping are better than traditional ultrasonic no matter in terms of material removal and surface quality. The material removal rate are all showed a trend of decrease after the first increase with the increase of the output current,inmedance threshold,lapping speed and lapping time,but the increasing speed are not identical. Instead,the surface quality are all showed a trend of increase after the first decrease and there is a best value.