Ni-SiC复合电铸层内应力实验研究

提出通过掺杂SiC颗粒来减小Ni微电铸层内应力的新方法,基于UV-LIGA工艺制作了纯镍电铸层和Ni-SiC复合电铸层,采用X射线衍射法测量微电铸层的内应力,分析SiC颗粒对微电铸层内应力的影响效果。利用L_9(3~4)正交试验考查了铸液中SiC浓度、电流密度、搅拌转速及电铸温度等工艺参数对复合电铸层内应力的影响。结果表明:掺杂SiC颗粒能有效减小微电铸层内应力,电流密度和铸液中SiC浓度对内应力的影响大于搅拌转速和电铸温度。复合电铸层内应力实验的最优工艺参数为:SiC浓度20 g/L,电流密度1 A/dm~2,磁力搅拌转速600 r/min,电铸温度50℃。

Experimental Study on Internal Stress in Ni-SiC Composite Electroforming

A new method to reduce the internal stress in Ni micro electroforming layer by codeposition SiC particles is proposed. The pure nickel electroforming layer and the Ni-SiC composite electroforming layer were prepared. The internal stress of the micro electroformed layer was measured by X-ray diffraction method. The influence of SiC particles on the internal stress in the micro electroforming layer was analyzed. The effects of SiC concentration,current density,stirring speed and electroforming temperature on the internal stress in the electroforming layer were investigated by L9(34) orthogonal experiment. The result shows that the SiC particles can effectively reduce the internal stress in the micro electroforming layer,and the effects of the current density and the SiC concentration are greater than that of the magnetic stirring speed and the electroforming temperature on reducing the internal stress. The optimum process parameters of the composite electroforming layer are: the concentration of SiC is 20 g/L,the current density is 1 A/dm2,the magnetic stirring speed is 600 r/min and the electroforming temperature is 50 ℃.