温度传感器陶瓷热敏元件包封的设计与响应时间的研究

陶瓷热敏元件可视不同的使用环境选择单层或复合包封。根据传热学理论，建立了包封系统瞬态导热方程，并在简化假设条件下得到了热响应时间的解析解，分析了响应时间的取决因素，依据包封材料的热物性计算出几种包封方案响应时间的理论值。通过实验，对几种包封系统热响应时间进行了测量。其结果与理论值接近，表明该理论可用于指导最佳包封方案的设计。

Design of Packaging of Ceramic Thermosensitive Components in Thermistors and Their Response Times

Monolayer or combined packaging of ceramic thermosensitive components is selected in dependence on their application environment. According to thermoconduction theory transient thermoconduction equation for packaging system is established and it's analytic solution for thermoresponse times is obtained under simplified assumption. Dependence of response times on some factors is analyzed and theoretical values of response times for some packaging options have been calculated from thermal properties of packaging materials.The thermoresponse times of some packaging systems have been measured experimentally obtained results are approaching to their theoretical Values. It is indicated that the theory may be applied to design optimal packaging options.