| ENIG焊点的失效机理及镀层重工方法研究 |
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| 引用本文： | 周斌,邱宝军. ENIG焊点的失效机理及镀层重工方法研究[J]. 半导体技术, 2010, 35(7): 691-694,698. DOI: 10.3969/j.issn.1003-353x.2010.07.020 |
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| 作者姓名： | 周斌 邱宝军 |
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| 作者单位： | 电子元器件可靠性物理及其应用技术国防科技重点实验室,广州,510610;电子元器件可靠性物理及其应用技术国防科技重点实验室,广州,510610 |
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| 摘 要： | 采用显微形貌、微观结构和元素成分分析等物理分析方法,以不同类型的化镍浸金(electroless nickel/immersion gold,ENIG)基板为对象,分析了其焊点在不同情形下的失效模式和失效机理,阐述了黑盘缺陷的主要失效特征,研究了具有黑盘缺陷的化镍浸金基板的重工工艺.研究结果显示,Ni层断裂表面单一的高P含量或轻微Ni层腐蚀不能作为黑盘缺陷的唯一依据,已形成良好金属间化合物(intermetallic compound,IMC)层的Ni层腐蚀位置的焊接界面仍具有良好的机械结合强度,采用喷锡工艺(hot air solder level,HASL)对具有黑盘缺陷的化镍浸金基板进行重新处理切实可行.
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| 关 键 词： | 化镍浸金 焊点 失效机理 黑焊盘 重工 金属间化合物 |
Study on Failure Mechanisms of ENIG Solder Joints and Rework Method for Plating |
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| Zhou Bin,Qiu Baojun. Study on Failure Mechanisms of ENIG Solder Joints and Rework Method for Plating[J]. Semiconductor Technology, 2010, 35(7): 691-694,698. DOI: 10.3969/j.issn.1003-353x.2010.07.020 |
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| Authors: | Zhou Bin Qiu Baojun |
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| Affiliation: | Zhou Bin,Qiu Baojun(National Key Laboratory of Science and Technology on Reliability Physics and Application of Electrical Component,Guangzhou 510610,China) |
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| Abstract: | Through physics analysis methods such as micro-appearance,microstructure and element composition analysis,the failure modes and failure mechanisms of various ENIG(electroless nickel/immersion gold) solder joints are studied under different conditions.The main failure characteristic related to black pad is described and the rework process of ENIG pads with black pad defect is investigated.The results show that it is not the exclusive criterion of black pad defect that only high phosphorus(P)content or slight... |
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| Keywords: | ENIG solder joint failure mechanism black pad rework intermetallic compound |
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