| 微电子封装引线键合工艺参数的概率设计 |
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| 引用本文： | 吴辉贤,许杨剑,刘勇.微电子封装引线键合工艺参数的概率设计[J].机械强度,2012(4):516-521. |
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| 作者姓名： | 吴辉贤 许杨剑 刘勇 |
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| 作者单位： | 浙江工业大学机械工程学院 |
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| 基金项目： | 国家自然科学基金(51005208);浙江省自然科学基金(Y1100120);浙江省教育厅(Y200908204)资助项目~~ |
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| 摘 要： | 建立多组不同网格密度的二维引线键合工艺有限元模型,从中选择一种精度较高、计算速度较快的模型进行数值模拟,并在此基础上采用Ansys概率有限元分析模块,选择蒙特卡洛模拟方法对引线键合工艺进行概率可靠性分析。研究和讨论各材料层中最大应力可能的分布区域以及应力对金属球直径、铝层厚度、键合高度、钢嘴几何结构和铝、铜与层间绝缘层ILD(interlayer dielectric)材料属性的敏感度。结果表明,金属球直径、铝层厚度、键合高度对应力的影响最明显,而其他输入参数对应力没有明显影响。
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| 关 键 词： | 引线键合 网格密度 蒙特卡罗模拟法 概率设计 |
PROBABILISTIC DESIGN OF THE PARAMETERS FOR WIREBONDING PROCESS IN MICROELECTRONIC PACKAGING |
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| WU HuiXian XU YangJian LIU Yong.PROBABILISTIC DESIGN OF THE PARAMETERS FOR WIREBONDING PROCESS IN MICROELECTRONIC PACKAGING[J].Journal of Mechanical Strength,2012(4):516-521. |
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| Authors: | WU HuiXian XU YangJian LIU Yong |
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| Affiliation: | WU HuiXian XU YangJian LIU Yong (Zhejiang University of Technology,College of Mechanical Engineering,Hangzhou 310014,China) |
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| Abstract: | A model which has high precision and computational efficiency has been chosen in multiple models with different mesh density,and then a numerical simulation is implemented based on this model,Further,the probabilistic reliability analysis of wire bonding is carried out by using the probabilistic design system of the Ansys software and Monte Carlo simulation method.The distribution probabilities of the peak stress values and the sensitivities of the stress to free air ball radius,Al pad thickness,ball bonding height,geometry of capillary and Al,Cu and ILD(interlayer dielectric) material properties in different material layers are discussed.The results show that free air ball radius,Al pad thickness and ball bonding height are the sensitivity factors to stress in the wire bonding structure,and the other input variables have no significant on stress. |
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| Keywords: | Bonding wire Mesh density Monte Carlo simulation method Probabilistic design |
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