| 金属填充聚合物屏蔽EMI包装材料 |
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| 引用本文： | 杜仕国,施冬梅,邓辉. 金属填充聚合物屏蔽EMI包装材料[J]. 包装工程, 2000, 21(4): 19-21 |
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| 作者姓名： | 杜仕国 施冬梅 邓辉 |
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| 作者单位： | 军械工程学院三系,河北石家庄,050003 |
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| 摘 要： | 在介绍电磁蔽原理的基础上，分析了金属填充聚合物复合材料屏蔽效能主要影响因素，并了屏蔽ＥＭＩ包装材料的研究现状与发展。
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| 关 键 词： | 电磁屏蔽 屏蔽效能 复合材料 EMI包装材料 |
| 文章编号： | 1001-3563(2000)04-0019-03 |
| 修稿时间： | 2000-06-26 |
Metal-filled Polymer Packaging Materials for Shielding EMI |
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| DU Shi-guo,SHI Dong-mei,DENG Hui. Metal-filled Polymer Packaging Materials for Shielding EMI[J]. Packaging Engineering, 2000, 21(4): 19-21 |
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| Authors: | DU Shi-guo SHI Dong-mei DENG Hui |
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| Abstract: | On the basis of introducing the principle of electromagnetic shielding,the main factors which affect the shielding effects of metal-filled polymer composites were described,the study situation and the development di- rection of packaging materials for shielding EMI were also discussed in the paper. |
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| Keywords: | Electromagnetic shielding Shielding effects Composite materials Packaging materials |
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