| MEMS器件封装的低温玻璃浆料键合工艺研究 |
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| 引用本文： | 虞国平,王明湘,俞国庆.MEMS器件封装的低温玻璃浆料键合工艺研究[J].半导体技术,2009,34(12). |
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| 作者姓名： | 虞国平 王明湘 俞国庆 |
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| 作者单位： | 晶方半导体科技(苏州)有限公司,江苏,苏州,215126;晶方半导体科技(苏州)有限公司,江苏,苏州,215126;晶方半导体科技(苏州)有限公司,江苏,苏州,215126 |
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| 基金项目： | 江苏省自然科学基金资助项目 |
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| 摘 要： | 玻璃浆料是一种常用于MEMS器件封装的密封材料.系统研究了MEMS器件在低温下使用玻璃浆料键合硅和玻璃的过程.与大多数MEMS器件采用的玻璃浆料相比(烧结温度400℃以上),此工艺(烧结温度350℃)在键合完成后所形成的封装结构同样具有较高的剪切强度(封装器件剪切强度大于360 kPa),同时具有较好的气密性(合格率达到93.3%),漏率测试结果符合相关标准.结果表明,在保证MEMS器件封装剪切强度和气密性的同时,降低键合温度条件是可以实现的.
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| 关 键 词： | 微机电系统 气密封装 玻璃浆料键合 低温 圆片级封装 |
Study on Low Temperature Glass Frit Bonding for MEMS Device |
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| Yu Guoping,Wang Mingxiang,Yu Guoqing.Study on Low Temperature Glass Frit Bonding for MEMS Device[J].Semiconductor Technology,2009,34(12). |
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| Authors: | Yu Guoping Wang Mingxiang Yu Guoqing |
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| Abstract: | Glass frit is a kind of sealing material for MEMS device. The bonding process of Si and glass for MEMS device at low-temperature with glass frit were studied. Compared to the glass frit for most MEMS devices (sintering temperature is above 400℃), the package structure formed after bonding (sintering temperature is 350℃) by the new process has higher shear strength (> 360 kPa), and better sealing (yield is up to 93.3%). The leak rate fits the relative standard. The results show that both shear strength and leak rate are encouraging. It is proved that the MEMS package can be hermetically sealed at the low temperature of 350℃. |
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| Keywords: | MEMS device hermetic package glass frit bonding low temperature package waferlevel package |
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