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Robust Finite Element Model for the Design of Thermoelectric Modules
Authors:Emil Sandoz-Rosado  Robert Stevens
Affiliation:(1) Materials Science, Co., Ltd, 5-5-44, Minamikasugaoka, Ibaraki, Osaka 567-0046, Japan;(2) Advanced Materials, Co., Ltd, 4-6-10, Kizuri, Higashiosaka, Osaka 577-0827, Japan;(3) Faculty of Engineering, Ehime University, Bunkyocho, Matsuyama 790-8577, Japan
Abstract:Thermoelectric devices for power generation have been receiving increased attention as an emerging sustainable energy technology because of recent advances in thermoelectric materials and the tremendous thermal resources available. Little focus has been given to the effective implementation of thermoelectric materials in power generation modules and efficient module design. With recent exploration into new module configurations, it is imperative that a comprehensive model be developed as a design tool. A new three-dimensional, device-level, multiphysics modeling technique is developed for the purposes of designing and evaluating thermoelectric module configurations. Using the new model, we identify and explore several geometric parameters which are critical to module performance. The impact on device performance of solder, ceramic interface, and electrical contact thickness, as well as the leg spacing, is evaluated for a standard unicouple configuration. Results are compared to the standard one-dimensional constant property models commonly used in thermoelectric module design.
Keywords:
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