| 装配工艺的发展与维修性方向研究 |
| |
| 引用本文： | 杨志飞. 装配工艺的发展与维修性方向研究[J]. 电子质量, 1995, 0(2) |
| |
| 作者姓名： | 杨志飞 |
| |
| 作者单位： | 电子部第五研究所 |
| |
| 摘 要： | 分析了微电子与微组装工艺的发展趋势,论述了21世纪电子整机制造缺陷的消除技术,探讨未来高技术高密度高效能小体积电子整机的维修问题,提出21世纪电子整机维修性的科研方向。
|
| 关 键 词： | 装配工艺 维修 |
The Research Tendency for Assembly Process And Maintainability |
| |
| Yang Zhifei. The Research Tendency for Assembly Process And Maintainability[J]. Electronics Quality, 1995, 0(2) |
| |
| Authors: | Yang Zhifei |
| |
| Affiliation: | Yang Zhifei |
| |
| Abstract: | The author has analysed the progress tendency of microelectronic and assembling process. Opinions has been put forward for the reduction of equipment mannufacture failure , and maintenance approaches for the future hi - tech, hi - performance and small size equipment as well as the science and technology research orientation in 21th century. |
| |
| Keywords: | Assembly process Maintenance |
| 本文献已被 CNKI 等数据库收录！ |
|
