Averaging approach for microchannel heat sinks subject to the uniform wall temperature condition |
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| Affiliation: | 1. School of Mechanical Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon, Gyeonggi 440-746, Republic of Korea;2. Vacuum Center, Korea Research Institute of Standards and Science, 267 Gajeong-ro, Yuseong-gu, Daejeon 305-340, Republic of Korea;3. SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon, Gyeonggi 440-746, Republic of Korea;1. State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Beijing 102206, China;2. Beijing Key Laboratory of Multiphase Flow and Heat Transfer for Low Grade Energy, North China Electric Power University, Beijing 102206, China;3. School of Mathematics and Physics, North China Electric Power University, Beijing 102206, China;1. School of Naval Architecture and Ocean Engineering, Huazhong University of Science and Technology, Wuhan 430074, People’s Republic of China;2. Key Laboratory of Material Chemistry for Energy Conversion and Storage, Ministry of Education, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, People’s Republic of China;1. Kufa Centre for Advanced Simulation in Engineering (KCASE), Department of Mechanical Engineering, Faculty of Engineering, University of Kufa, Najaf, Iraq;2. Modeling and Simulation Lab., Faculty of Basic Education, University of Kufa, Najaf, Iraq;3. School of Chemical and Process Engineering, University of Leeds, Leeds, UK |
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| Abstract: | The present paper is devoted to modeling methods for thermal analysis of microchannel heat sinks. The averaging approach presented in earlier works for the case of constant surface heat flux is extended to the problems subject to the uniform wall temperature condition. The solutions for velocity and temperature distributions are obtained by solving one-dimensional averaged governing equations without resorting to a two-dimensional direct numerical simulation. General solutions for both high-aspect-ratio and low-aspect-ratio microchannel heat sinks are presented. Asymptotic solutions in high-aspect-ratio and low-aspect-ratio limits are also given in explicit form. The solutions presented in the paper are validated by comparing them with the results of direct numerical simulation. The friction factors, Nusselt numbers and thermal resistances for microchannel heat sinks with a uniform base temperature are obtained from the presented solutions. The effects of the aspect ratio and the porosity on the friction factor and the Nusselt number are presented. Finally, characteristics of the thermal resistance of the microchannel heat sink are discussed. |
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