电子封装材料过共晶硅-铝合金的组织特征和热性能(英文)

采用快速凝固制粉技术和粉末热压烧结技术制备55%Si-Al,70%Si-Al和90%Si-Al3种过共晶含量的硅铝合金。结果表明:雾化沉积是制备过共晶硅铝合金的有效的快速凝固工艺,采用该工艺获得的快速凝固硅铝合金粉末的尺寸小于50μm。快速凝固的硅铝合金粉末经过550°C和700MPa热压后,获得3种不同成分合金试样的相对密度分别为99.4%,99.2%和94.4%。作为电子封装材料,3种试样的热导率、热膨胀系数和电导率都可以满足应用要求。55%Si-Al合金的热膨胀系数随温度的变化最剧烈,但是该合金具有较好的热导率。90%Si-Al合金的热膨胀系数较小,但是其热导率最差,小于100W/(m·K)。70%Si-Al合金具备热沉材料所应具备的优良的热导率和热膨胀系数的综合性能。

Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications

The rapid solidified process and hot press method were performed to produce three hypereutectic 55%Si-Al,70%Si-Al and 90%Si-Al alloys for heat dissipation materials.The results show that the atomization is an effective rapid solidified method to produce the Si-Al alloy and the size of atomized Si-Al alloy powder is less than 50 μm.The rapid solidified Si-Al alloy powder were hot pressed at 550 °C with the pressure of 700 MPa to obtain the relative densities of 99.4%,99.2% and 94.4% for 55%Si-Al,70%Si-Al and 90%Si-Al alloys,respectively,The typical physical properties,such as the thermal conductivity,coefficient of thermal expansion(CTE) and electrical conductivity of rapid solidified Si-Al alloys are acceptable as a heat dissipation material for many semiconductor devices,The 55%Si-Al alloy changes greatly(CTE) with the increase of temperature but obtains a good thermal conductivity.The CTE of 90%Si-Al alloy matches with the silicon very well but its thermal conductivity value is less than 100 W/(m·K).Therefore,the 70%Si-Al alloy possesses the best comprehensive properties of CTE and thermal conductivity for using as the heat sink materials.