PBGA固化后产生翘曲的有限元模拟分析

由于PBGA器件中各材料热膨胀系数有差异,固化后易产生翘曲变形。采用有限元模拟法对PBGA器件的EMC封装固化和后固化过程进行了分析。结果表明:固化过程是影响翘曲的关键过程,残余应力增加,翘曲变形有所增加。如固化后最大残余应力为95.24MPa,翘曲位移为0.1562mm;后固化以后最大残余应力为110.3MPa,翘曲位移为0.1674mm,翘曲位移增加值仅为0.0112mm。适当增加硅粉填充剂的含量,可以减小固化工艺后的翘曲变形。

Finite element simulation analysis on warpage after solidifying process of PBGA

As mismatch of thermal expansion coefficients of each materials in PBGA device, they easy warp after solidifying process. Processes of solidifying and post solidifying of EMC package for PBGA were analyzed by finite element simulation method. Results show that solidifying process is the key process to influence warpage, the warped deformation increases with increment of residual stress, such as the max residual stress is 95.24 MPa after solidifying, the warped deformation value is 0.156 2 mm; the max residu...