| 穿孔再流焊技术 |
| |
| 引用本文： | 董景宇. 穿孔再流焊技术[J]. 电子与封装, 2005, 5(1): 16-18 |
| |
| 作者姓名： | 董景宇 |
| |
| 作者单位： | 中国电子科技集团公司第二十七研究所,河南,郑州,450005 |
| |
| 摘 要： | 本文介绍了混装印制板装联技术的工艺流程和各自特点,并着重介绍了穿孔再流焊技术的原 理和工艺参数设计。
|
| 关 键 词： | 穿孔再流焊 模板设计 焊膏量 |
| 文章编号： | 1681-1070(2005)01-16-03 |
| 修稿时间： | 2004-08-15 |
Pin-through-hole Reflow Soldering Technology |
| |
| Dong Jing-yu. Pin-through-hole Reflow Soldering Technology[J]. Electronics & Packaging, 2005, 5(1): 16-18 |
| |
| Authors: | Dong Jing-yu |
| |
| Abstract: | This article introduce the flow chart of technology and their different characteristic in the installation and wiring of electric equipment PCB mixed pin-through-hole and SMD,expound the principle and the design of technical parameters of Pin-through-hole Reflow Soldering Technology. |
| |
| Keywords: | Pin-through-hole reflow soldering Stencil design Solder paste volume |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
